1064nm和355nm激光扫描刻蚀覆铜板工艺及质量研究

傅茜; 张菲; 蒋明; 段军; 曾晓雁

doi:10.7510/jgjs.issn.1001-3806.2014.04.001

1064nm和355nm激光扫描刻蚀覆铜板工艺及质量研究

1.
华中科技大学武汉光电国家实验室, 武汉 430074

通讯作者: 段军, duans@mail.hust.edu.cn ;

基金项目:
国家自然科学基金重点项目基金资助项目（51135005）
中图分类号:
TG156.99;TN249

Study on technology and quality of etching copper clad laminate with 1064nm and 355nm laser

1.
Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology, Wuhan 430074, China

Corresponding author: DUAN Jun, duans@mail.hust.edu.cn ;

CLC number:
TG156.99;TN249

摘要: 为了研究不同纳秒激光工艺参量（波长、能量密度、扫描速率）以及铜层厚度对激光刻蚀覆铜板质量（包括刻蚀深度及加工面粗糙度）的影响，采用50W的1064nm红外光纤激光器和10W的355nm紫外固体激光器对覆铜板进行了对比刻蚀实验。通过分析红外、紫外激光刻蚀覆铜板材料的作用机理并对比实验结果得知，采用1064nm红外光纤激光作为激光光源时，设置合适的刻蚀参量，能在完全去除铜箔层的条件下，最大限度地保证环氧树脂基底的完整性；而采用355nm的紫外激光作为激光光源时，因环氧树脂材料对紫外波段激光的高吸收率，以及紫外激光对有机材料的光化学作用，基底材料的损伤难以避免，此外，红外光纤激光具有较高的刻蚀效率。结果表明，综合光纤激光器高稳定性和高集成度的特点，若激光直接刻蚀技术被用于大规模覆铜板的工业加工中，红外光纤激光将更具优势性。
- 激光技术 /
- 1064nm红外激光 /
- 355nm紫外激光 /
- 覆铜板
Abstract: In order to study effect of nanosecond laser processing parameters (such as wavelength, laser fluence, scanning speed) and thickness of the copper layer on the processing quality of laser etching copper clad laminate (including depth and roughness), a 50W 1064nm infrared fiber laser and a 10W 355nm ultraviolet solid-state laser were used for etching the copper clad laminate(CCL) in the comparative experiments. The action mechanisms of infrared laser and ultraviolet laser were analyzed. In the experiments, the 1064nm fiber laser with proper process parameters could etch the copper layer entirely and keep epoxy resin board intact. However, for the 355nm laser, the damage to the organic layer was unavoidable because of the high absorptivity to ultraviolet and photochemical effect. Besides, the infrared fiber laser had a higher processing efficiency. Therefore, with characteristics of high stability and stronger integration, 1064nm infrared fiber laser is more adapt to the large-scale industrial processing of CCL.
- laser technique /
- 1064nm infrared laser /
- 355nm ultraviolet laser /
- copper clad laminate

[1]	ZHANG H W. The principle and technology of modern printed circuit technology[M]. Beijing: China Machine Press, 2012:10-16(in Chinese).
[2]	HIROGAKI T, AOYAMA E, INOUE H, et al. Laser drilling of blind via holes in aramid and glass/epoxy composites for multi-layer printed wiring boards[J]. Applied Science and Manufacturing, 2001, 32(7): 963-968.
[3]	WANG X C, LI Z L, CHEN T, et al. 355nm DPSS UV laser cutting of FR4 and BT/epoxy-based PCB substrates[J].Optics and Lasers in Engineering, 2008, 46(5): 404-409.
[4]	YU X F, HE W, WANG Sh X, et al. Research on blind via drilling using UV laser[J]. Printed Circuit Information, 2011(4): 62-66(in Chinese).
[5]	ZHANG F, ZENG X Y, LI X Y, et al. Laser etching and cutting printed circuit board by 355nm and 1064nm diode pumped solid state lasers[J].Chinese Journal of Lasers, 2008, 35(10): 1637-1643 (in Chinese).
[6]	NOWAK M R, ANTON?ZAK A J, KOZIO? P E, et al. Laser prototyping of printed circuit boards [J]. Opto-Electronics Review, 2013, 21(3): 320-325.
[7]	ZHANG F, DUAN J,ZENG X Y, et al. Study of blind holes drilling on flexible circuit board using 355nm UV laser[J]. Chinese Journal of Lasers, 2009, 36(12):3143-3148(in Chinese).
[8]	YAN M Q, ZHU H H, CHEN Z H. Laser microvia process of printed circuit board [J]. Optics Optoelectronic Technology, 2007, 5(3): 37-40(in Chinese).
[9]	CAO Y, LI X Y, CAI Zh X, et al. Research progress of laser micro processing in integrated circuits manufacturing[J]. Optics Optoelectronic Technology, 2006, 4(4): 25-28(in Chinese).
[10]	MOORHOUSE C J, VILLARREAL F, WENDLAND J J, et al. Enhanced peak power CO2 laser processing of PCB materials [J]. Photonic Engineering, 2005, 5827(44): 438-445.
[11]	YUNG K C, MEI S M, YUE T M. A study of the heat affected zone in the UV YAG laser drilling of GFRP materials[J]. Journal of Materials Processing Technology, 2002,122(2/3): 278-285.
[12]	KONG R Z, LIU J Ch, WU Y F, et al. Positioning study in laser corrosion hemisphere platinum resistors[J]. Laser Technology, 2014, 38(3):321-324(in Chinese).
[13]	KONG L R, ZHANG F, DUAN J, et al. Research on water-assisted laser etching of alumina ceramics[J]. Laser Technology, 2014, 38(3):330-334(in Chinese).
[14]	RYTLEWSKI P, MRZ W,?ENKIEWICZ M, et al. Laser induced surface modification of polylactide[J]. Journal of Materials Processing Technology, 2012, 212(8): 1700-1704.

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1064nm和355nm激光扫描刻蚀覆铜板工艺及质量研究

通讯作者: 段军, duans@mail.hust.edu.cn ;

Study on technology and quality of etching copper clad laminate with 1064nm and 355nm laser

Corresponding author: DUAN Jun, duans@mail.hust.edu.cn ;

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1064nm和355nm激光扫描刻蚀覆铜板工艺及质量研究

通讯作者: 段军, duans@mail.hust.edu.cn;

English Abstract

Study on technology and quality of etching copper clad laminate with 1064nm and 355nm laser

Corresponding author: DUAN Jun, duans@mail.hust.edu.cn

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目录

留言板

1064nm和355nm激光扫描刻蚀覆铜板工艺及质量研究

通讯作者: 段军, duans@mail.hust.edu.cn ;

Study on technology and quality of etching copper clad laminate with 1064nm and 355nm laser

Corresponding author: DUAN Jun, duans@mail.hust.edu.cn ;

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1064nm和355nm激光扫描刻蚀覆铜板工艺及质量研究

通讯作者: 段军, duans@mail.hust.edu.cn;

English Abstract

Study on technology and quality of etching copper clad laminate with 1064nm and 355nm laser

Corresponding author: DUAN Jun, duans@mail.hust.edu.cn

全文HTML

目录