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Volume 26 Issue 4
Sep.  2013
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Article Navigation >  LASER TECHNOLOGY  > 2002 >  26(4): 250-251,254

Citation:
shu

Experimental research on Si cutting by using UV excimer laser

  • 1.

    Shanghai Institute of Optics & Fine Mechanics, The Chinese Academy of Sciences, Shanghai, 201800

  • Received Date: 2001-08-27
    Accepted Date: 2002-03-06
  • In this paper,the experimental results of Si wafer cutting by 193nm excimer laser are reported.By using cylinder focus system and "thermal-splits" technique,less than 15μm cutting gap with 5μm fluctuation of cutting edge are obtained.
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    Lou Q H,Wang R.Opt Laser Technol,1987,19(1):33～36.
    [2]

    Gower M C.SPIE,1999,3618:251～261.
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    Bloemberger N.Laser abalation mechanisms applications Ⅱ,AIP Conf Proceedings,1994.
    [4]

    Auston D H.A P L,1979,34(10):635～637.
  • 加载中
通讯作者: 陈斌, bchen63@163.com
  • 1. 

    沈阳化工大学材料科学与工程学院 沈阳 110142

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Experimental research on Si cutting by using UV excimer laser

  • 1. Shanghai Institute of Optics & Fine Mechanics, The Chinese Academy of Sciences, Shanghai, 201800
  • Received Date: 2001-08-27
  • Accepted Date: 2002-03-06
  • Available Online: 2002-07-25

Abstract: In this paper,the experimental results of Si wafer cutting by 193nm excimer laser are reported.By using cylinder focus system and "thermal-splits" technique,less than 15μm cutting gap with 5μm fluctuation of cutting edge are obtained.

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