A shortened procedure of micro-electromechanical systems fabrication by means of femtosecond laser

WANG Jian-zhong; SHI Tie-lin; XIONG Liang-cai

In order to study the feasibility of micro-electromechanical systems(MEMS) short processing technique with application of directly writing by means of femtosecond laser instead of traditional lithography,features of the material processing by means of femtosecond laser was analyzed and experiment was executed on 100 silicon wafers(SiN film thickness:350nm~500nm) by using a laser with 800nm wavelength and 50fs pulse width.Theoretic analysis and experimental result showed that femtosecond laser was superior for short process to nanosecond laser.MEMS shortened the processing flow and its cycle.Precise processing could be realized under precise control of laser pulse energy and workbench moving speed.

Corresponding author: SHI Tie-lin, tlshi@public.wh.hb.cn;

1. Wuhan National Laboratory for Optioelectronics, Huazhong University of Science and Technology, Wuhan 430074, China;

2. Naval University of Engineering, Wuhan 430033, China

Received Date: 2006-10-20

Accepted Date: 2007-01-12

Available Online: 2008-02-25

Abstract: In order to study the feasibility of micro-electromechanical systems(MEMS) short processing technique with application of directly writing by means of femtosecond laser instead of traditional lithography,features of the material processing by means of femtosecond laser was analyzed and experiment was executed on 100 silicon wafers(SiN film thickness:350nm~500nm) by using a laser with 800nm wavelength and 50fs pulse width.Theoretic analysis and experimental result showed that femtosecond laser was superior for short process to nanosecond laser.MEMS shortened the processing flow and its cycle.Precise processing could be realized under precise control of laser pulse energy and workbench moving speed.

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Reference (14)

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A shortened procedure of micro-electromechanical systems fabrication by means of femtosecond laser

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References

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