Abstract: Femtosecond laser ablation processing has small thermal zone, high laser resolution, and can weaken the physical plasma shielding effect when compared with traditional picosecond or nanosecond laser ablation. So, it is widely used in many areas. The mechanism of femtosecond laser ablation of transparent dielectric materials was expounded based on avalanche ionization and multiphoton ionization effects. In addition, the current status of femtosecond laser ablation of different microstructures was introduced. Particularly, the research methods and progress of ablation points, ablation lines and ablation surfaces of femtosecond laser micro-nano processing were reviewed at home and abroad in recent years. Also, the practical application of micro-functional structural components was summarized. Moreover, the current shortcomings of femtosecond lasers in the field of processing transparent dielectrics are analyzed, and the development of this technology is prospected.