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基于CBDC优化超声辅助水下激光切割单晶硅的工艺

Optimization of ultrasonic-assisted underwater laser cutting monocrystalline silicon process based on CBDC

  • 摘要: 为了对超声辅助水下纳秒激光切割工艺进行快速的优化,通过分析空化气泡动力学特性(CBDC)对工艺效果的影响,采用数值仿真分析、正交试验和高速摄像方法进行了理论分析和实验验证,得到了超声辅助水下激光切割工艺的优化参数,并验证了CBDC是影响切割工艺的主要因素。结果表明,随着空化气泡对激光束的干扰程度增加,切槽深度降低速度增加;随着切槽深宽比的增加,空化气泡脉动冲击对切槽底部产生的等效应力越大;当超声功率Pu=65 W、水层厚度hw=1 mm、激光脉冲频率fq=20 kHz、激光扫描速率v=1 mm/s时,可以获得最大深宽比约为1.71,槽宽约为99.88 μm,槽深约为170.18 μm,热影响区大小约为31.71 μm,微裂纹长度约为33.42 μm,此时空化气泡周期较短(约为100μs~160μs)。该研究可为多能场水下激光复合加工工艺参数的优化提供参考。

     

    Abstract: In order to rapidly optimize the ultrasonic-assisted underwater nanosecond laser cutting process, the impact of cavitation bubble dynamics characteristics (CBDC) on the process outcomes was analyzed. And theoretical analysis and experimental validation were carried out using numerical simulation analysis, orthogonal experiments, and high-speed imaging methods. Optimal parameters for the ultrasonic-assisted underwater laser cutting process were obtained, and the CBDC was confirmed to be the primary factor affecting the cutting process. The results showe that as the interference of cavitation bubbles with the laser beam increases, the cutting depth decreases while the cutting speed increases. As the depth-to-width ratio of the groove increases, the pulsating shock from cavitation bubbles exerte greater equivalent stress on the groove bottom. The maximum depth-to-width ratio of approximately is 1.71 achieved when ultrasonic power Pu=65 W, water layer thickness hw=1 mm, laser pulse frequency fq=20 kHz, and laser scanning speed v=1 mm/s, respectively. Under these conditions, the groove width is approximately 99.88 μm, the groove depth is approximately 170.18 μm, the size of the heat-affected zone is approximately 31.71 μm, and the microcrack length is approximately 33.42 μm. At this time, the cavitation bubble cycle is shorter (approximately 100 μs~160 μs). This research can provide valuable insights for optimizing the parameters of multi-field underwater laser composite processing.

     

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