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基于正交试验的超快激光环扫制孔的仿真实验参数优化

Optimization of experimental parameters for simulation of ultrafast laser ring-scanning holemaking based on orthogonal tests

  • 摘要: 为了优化气体扩散层上微孔的加工质量,采用激光环扫制孔的数值模型和实验研究方法,进行了理论分析和实验验证。结果表明,激光功率对微孔直径影响最大,其次是重复频率和扫描速率;而微孔深度主要受重复频率影响;激光功率对直径的影响趋势为先降后升,重复频率则持续下降;在低加工次数下,盲孔最优参数为功率3 W、频率1100 kHz、速率900 mm/s、间距20 μm、脉宽10 ps;在高加工次数下,通孔最优参数为功率3 W、频率600 kHz、速率900 mm/s、间距20 μm、脉宽10 ps。这一结果对气体扩散层微孔加工具有实际指导意义。

     

    Abstract: In order to optimize the processing quality of microholes on the gas diffusion layer, the numerical model and experimental research method of laser ring-scanning hole making were used for theoretical analysis and experimental verification. The results indicate that the laser power has the greatest influence on the diameter of microholes, followed by the repetition frequency and scanning speed, while the depth of microholes is mainly affected by the repetition frequency. Theoretical and experimental results show that the influence of laser power on the diameter tends to decrease and then increase, while the repetition frequency continues to decrease. The optimal parameters for blind holes are 3 W, 1100 kHz, 900 mm/s, 20 μm spacing, and 10 ps pulse width at low processing times, respectively, and for through holes are 3 W, 600 kHz, 900 mm/s, 20 μm spacing, and 10 ps pulse width at high processing times, which is of practical significance for the processing of gaseous diffusion layer microvias.

     

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