Abstract: In order to study the feasibility of micro-electromechanical systems(MEMS) short processing technique with application of directly writing by means of femtosecond laser instead of traditional lithography,features of the material processing by means of femtosecond laser was analyzed and experiment was executed on 100 silicon wafers(SiN film thickness:350nm~500nm) by using a laser with 800nm wavelength and 50fs pulse width.Theoretic analysis and experimental result showed that femtosecond laser was superior for short process to nanosecond laser.MEMS shortened the processing flow and its cycle.Precise processing could be realized under precise control of laser pulse energy and workbench moving speed.