Abstract: In order to study effect of nanosecond laser processing parameters (such as wavelength, laser fluence, scanning speed) and thickness of the copper layer on the processing quality of laser etching copper clad laminate (including depth and roughness), a 50W 1064nm infrared fiber laser and a 10W 355nm ultraviolet solid-state laser were used for etching the copper clad laminate(CCL) in the comparative experiments. The action mechanisms of infrared laser and ultraviolet laser were analyzed. In the experiments, the 1064nm fiber laser with proper process parameters could etch the copper layer entirely and keep epoxy resin board intact. However, for the 355nm laser, the damage to the organic layer was unavoidable because of the high absorptivity to ultraviolet and photochemical effect. Besides, the infrared fiber laser had a higher processing efficiency. Therefore, with characteristics of high stability and stronger integration, 1064nm infrared fiber laser is more adapt to the large-scale industrial processing of CCL.